Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103048 | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates | Tony D. Flaim | 2018-10-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103048 | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates | Tony D. Flaim | 2018-10-16 |