MH

Marco HARYONO

AD Atotech Deutschland: 1 patents #4 of 29Top 15%
Overall (2018): #320,702 of 503,207Top 65%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10077498 Method for depositing a copper seed layer onto a barrier layer and copper plating bath Matthias Dammasch, Sengül KARASAHIN, Hans-Jürgen Schreier 2018-09-18