Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10077498 | Method for depositing a copper seed layer onto a barrier layer and copper plating bath | Matthias Dammasch, Marco HARYONO, Sengül KARASAHIN | 2018-09-18 |
| 9920432 | Adhesion promoting agents for metallization of substrate surfaces | Thomas Thomas, Lutz Brandt, Lutz Stamp | 2018-03-20 |