Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096516 | Method of forming a barrier layer for through via applications | Kurtis Leschkies | 2018-10-09 |
| 10062561 | High-pressure annealing and reducing wet etch rates | Kurtis Leschkies, Keith Tatseun Wong | 2018-08-28 |
| 10032624 | Substrate support and baffle apparatus | Roman Gouk, Han-Wen Chen, Jean Delmas | 2018-07-24 |
| 9935004 | Process and chemistry of plating of through silicon vias | Roman Gouk | 2018-04-03 |
| 9935005 | Techniques for filling a structure using selective surface modification | Kurtis Leschkies | 2018-04-03 |