Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10105794 | Method of forming a lead-free solder composition | Jennie S. Hwang, John Pereira, Alexandra Mary Mackin | 2018-10-23 |
| 9975207 | Lead-free solder composition | Jennie S. Hwang, John Pereira, Alexandra Mary Mackin | 2018-05-22 |