Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10105794 | Method of forming a lead-free solder composition | Jennie S. Hwang, John Pereira, Joseph C. Gonsalves | 2018-10-23 |
| 9975207 | Lead-free solder composition | Jennie S. Hwang, John Pereira, Joseph C. Gonsalves | 2018-05-22 |
| 9925611 | Electrical component having presoldered surface with flux reservoirs | John Pereira, Matthew Jarod Scherer | 2018-03-27 |