Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9859896 | Distributed multi-die routing in a multi-chip module | Brian C. Gaide, Eric F. Dellinger | 2018-01-02 | $44,079,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9859896 | Distributed multi-die routing in a multi-chip module | Brian C. Gaide, Eric F. Dellinger | 2018-01-02 | $44,079,000 |