Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10110202 | Distributed voltage and temperature compensation for clock deskewing | John O'Dwyer | 2018-10-23 | $18,242,000 |
| 10043724 | Using an integrated circuit die for multiple devices | Nui Chong | 2018-08-07 | $10,177,000 |
| 9859896 | Distributed multi-die routing in a multi-chip module | Steven P. Young, Eric F. Dellinger | 2018-01-02 | $44,079,000 |