Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10032682 | Multi-die wafer-level test and assembly without comprehensive individual die singulation | Matthew H. Klein, Glenn O'Rourke | 2018-07-24 | $14,986,000 |
| 9989572 | Method and apparatus for testing interposer dies prior to assembly | Ganesh Hariharan, Amitava Majumdar | 2018-06-05 | $30,167,000 |
| 9865567 | Heterogeneous integration of integrated circuit device and companion device | Ganesh Hariharan, Inderjit Singh, Amitava Majumdar, Glenn O'Rourke | 2018-01-09 | $17,814,000 |