Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10032682 | Multi-die wafer-level test and assembly without comprehensive individual die singulation | Matthew H. Klein, Raghunandan Chaware | 2018-07-24 | $14,986,000 |
| 9865567 | Heterogeneous integration of integrated circuit device and companion device | Raghunandan Chaware, Ganesh Hariharan, Inderjit Singh, Amitava Majumdar | 2018-01-09 | $17,814,000 |