Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10132773 | Using floating gate field effect transistors for chemical and/or biological sensing | Kalle Levon, Tsunehiro Sai, Ben Zhao | 2018-11-20 |
| 10082541 | Mixed redundancy scheme for inter-die interconnects in a multichip package | Dana How, Dinesh Patil, Jeffrey Erik Schulz | 2018-09-25 |
| 10020267 | 2.5D electronic package | Karthik Chandrasekar | 2018-07-10 |
| 9971733 | Scalable 2.5D interface circuitry | Chee Hak Teh | 2018-05-15 |
| 9966362 | Integrated circuit package with inter-die thermal spreader layers | Tony Ngai | 2018-05-08 |
| 9935052 | Power line layout in integrated circuits | Hui Liu, Karthik Chandrasekar, Kyung Suk Oh, Kaushik Chanda | 2018-04-03 |