Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10064276 | 3D bendable printed circuit board with redundant interconnections | Richard K. Williams | 2018-08-28 |
| 10032649 | Method of fabricating low-profile footed power package | Richard K. Williams | 2018-07-24 |
| 10032744 | Universal surface-mount semiconductor package | Richard K. Williams | 2018-07-24 |
| 9895550 | Flexible LED light pad for phototherapy | Richard K. Williams, Yu-Min Lin, Daniel Schell, Joseph P. Leahy | 2018-02-20 |