Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074716 | Saucer-shaped isolation structures for semiconductor devices | Wai Tien Chan, Donald R. Disney | 2018-09-11 |
| 10064276 | 3D bendable printed circuit board with redundant interconnections | Keng Hung Lin | 2018-08-28 |
| 10032649 | Method of fabricating low-profile footed power package | Keng Hung Lin | 2018-07-24 |
| 10032744 | Universal surface-mount semiconductor package | Keng Hung Lin | 2018-07-24 |
| 10008438 | Low profile leaded semiconductor package and method of fabricating the same | — | 2018-06-26 |
| 9998434 | Secure dynamic communication network and protocol | Ievgen Verzun, Oleksandr Holub | 2018-06-12 |
| 9905640 | Isolation structures for semiconductor devices including trenches containing conductive material | Wai Tien Chan, Donald R. Disney | 2018-02-27 |
| 9895550 | Flexible LED light pad for phototherapy | Keng Hung Lin, Yu-Min Lin, Daniel Schell, Joseph P. Leahy | 2018-02-20 |
| 9877361 | Phototherapy system and process including dynamic LED driver with programmable waveform | — | 2018-01-23 |