Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10154588 | Manufacturing method of semiconductor package | Hwee-Seng Jimmy Chew | 2018-12-11 |
| 10109503 | Method of manufacturing semiconductor package device | Jimmy Chew, Oviso Dominador Jr Fortaleza, Kian-Hock Lim | 2018-10-23 |
| 10049950 | Multi-layer substrate for semiconductor packaging | Hwee-Seng Jimmy Chew | 2018-08-14 |
| 9892916 | Manufacturing method of package substrate and package manufacturing method of semiconductor device | Hwee-Seng Jimmy Chew | 2018-02-13 |