Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10154588 | Manufacturing method of semiconductor package | Shoa-Siong Raymond Lim | 2018-12-11 |
| 10049950 | Multi-layer substrate for semiconductor packaging | Shoa-Siong Raymond Lim | 2018-08-14 |
| 9892916 | Manufacturing method of package substrate and package manufacturing method of semiconductor device | Shoa-Siong Raymond Lim | 2018-02-13 |