Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786588 | Circuit substrate and package structure | Hsin-I Chuang, Ting-You Wei | 2017-10-10 |
| 9601425 | Circuit substrate and semiconductor package structure | Yeh Hsu | 2017-03-21 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786588 | Circuit substrate and package structure | Hsin-I Chuang, Ting-You Wei | 2017-10-10 |
| 9601425 | Circuit substrate and semiconductor package structure | Yeh Hsu | 2017-03-21 |