TW

Ting-You Wei

VC Via Alliance Semiconductor Co.: 1 patents #27 of 62Top 45%
📍 New Taipei, TW: #700 of 2,136 inventorsTop 35%
Overall (2017): #214,894 of 506,227Top 45%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9786588 Circuit substrate and package structure Chen-Yueh Kung, Hsin-I Chuang 2017-10-10