Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773684 | Method of manufacturing fan out wafer level package | Yibo Liu, Feng Chen, Dongkai Shangguan, Peng SUN | 2017-09-26 |
| 9688727 | Desmoglein 2 (DSG2) binding proteins and uses therefor | Andre Lieber | 2017-06-27 |