DS

Dongkai Shangguan

NC National Center For Advanced Packaging Co.: 1 patents #1 of 14Top 8%
Overall (2017): #436,241 of 506,227Top 90%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9773684 Method of manufacturing fan out wafer level package Hongjie Wang, Yibo Liu, Feng Chen, Peng SUN 2017-09-26