Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818676 | Singulation method for semiconductor package with plating on side of connectors | Saravuth Sirinorakul | 2017-11-14 |
| 9773722 | Semiconductor package with partial plating on contact side surfaces | Saravuth Sirinorakul, Woraya Benjavasukul | 2017-09-26 |
| 9761435 | Flip chip cavity package | Saravuth Sirinorakul | 2017-09-12 |
| 9741642 | Semiconductor package with partial plating on contact side surfaces | Saravuth Sirinorakul, Woraya Benjasukul | 2017-08-22 |
| 9711343 | Molded leadframe substrate semiconductor package | Saravuth Sirinorakul | 2017-07-18 |