Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786813 | Thin-film flip-chip light emitting diode having roughening surface and method for manufacturing the same | Jing-En Huang, Sie-Jhan Wu | 2017-10-10 |
| 9748147 | Method of fabricating epitaxial layer | Li-Wei Feng, Li-Chieh Hsu, Chun-Jen Chen, I-Cheng Hu, Tien-I Wu +2 more | 2017-08-29 |
| 9680022 | Semiconductor device having silicon-germanium layer on fin and method for manufacturing the same | Tien-Chen Chan, Yen-Hsing Chen, Chun-Yu Chen, Chung-Ting Huang, Zih-Hsuan Huang +3 more | 2017-06-13 |
| 9653603 | Semiconductor device and method for fabricating the same | Li-Wei Feng, Shih-Hung Tsai, Kun-Hsin Chen, Tong-Jyun Huang, Jyh-Shyang Jenq +1 more | 2017-05-16 |
| 9577154 | Light emitting chip | Yu-Yun Lo, Chih-Ling Wu, Yi-Ru Huang, Jing-En Huang, Shao-Ying Ting | 2017-02-21 |
| 9564554 | Thin-film flip-chip light emitting diode having roughening surface and method for manufacturing the same | Jing-En Huang, Sie-Jhan Wu | 2017-02-07 |