Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761509 | Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device | Kuei-Sheng Wu | 2017-09-12 |
| 9748167 | Silicon interposer, semiconductor package using the same, and fabrication method thereof | — | 2017-08-29 |
| 9666507 | Through-substrate structure and method for fabricating the same | Chun-Hung Chen, Chien-Li Kuo | 2017-05-30 |