Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704841 | Method of packaging stacked dies on wafer using flip-chip bonding | — | 2017-07-11 |
| 9698122 | Semiconductor package structure and method for manufacturing the same | — | 2017-07-04 |
| 9666507 | Through-substrate structure and method for fabricating the same | Chun-Hung Chen, Ming-Tse Lin | 2017-05-30 |