Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9558996 | Method for filling trench with metal layer and semiconductor structure formed by using the same | Chi-Mao Hsu, Hsin-Fu Huang, Min-Chuan Tsai, Chien-Hao Chen, Wei-Yu Chen +3 more | 2017-01-31 |