Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831103 | Manufacturing method of interposed substrate | Dyi-Chung Hu, Ming-Chih Chen | 2017-11-28 |
| 9781843 | Method of fabricating packaging substrate having embedded through-via interposer | Dyi-Chung Hu | 2017-10-03 |