Issued Patents 2017
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837347 | Coaxial copper pillar | — | 2017-12-05 |
| 9831103 | Manufacturing method of interposed substrate | Ming-Chih Chen, Tzyy-Jang Tseng | 2017-11-28 |
| 9806044 | Bonding film for signal communication between central chip and peripheral chips and fabricating method thereof | — | 2017-10-31 |
| 9799622 | High density film for IC package | — | 2017-10-24 |
| 9799616 | Package substrate with double sided fine line RDL | — | 2017-10-24 |
| 9788427 | Circuit board structure with embedded fine-pitch wires and fabrication method thereof | — | 2017-10-10 |
| 9781843 | Method of fabricating packaging substrate having embedded through-via interposer | Tzyy-Jang Tseng | 2017-10-03 |
| 9756738 | Redistribution film for IC package | — | 2017-09-05 |
| 9737215 | Reflective sensing module having light chip and sensor chip mounted to bottom surface of transparent top cover, and wristband comprising said reflective sensing module | — | 2017-08-22 |
| 9735079 | Molding compound wrapped package substrate | — | 2017-08-15 |
| 9691717 | Fabricating process for package substrate | — | 2017-06-27 |
| 9691661 | Low profile IC package | — | 2017-06-27 |
| 9685429 | Stacked package-on-package memory devices | — | 2017-06-20 |
| 9673148 | System in package | — | 2017-06-06 |
| 9627285 | Package substrate | — | 2017-04-18 |
| 9578742 | Circuit board structure and method for manufacturing the same | Shih-Liang Cheng, Yu-Hua Chen | 2017-02-21 |
| 9545776 | Wafer reconfiguration | — | 2017-01-17 |
| 9543249 | Package substrate with lateral communication circuitry | — | 2017-01-10 |