Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698082 | Au-based solder die attachment semiconductor device and method for manufacturing the same | Satoshi Tanimoto, Shinji Sato, Hidekazu Tanisawa | 2017-07-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698082 | Au-based solder die attachment semiconductor device and method for manufacturing the same | Satoshi Tanimoto, Shinji Sato, Hidekazu Tanisawa | 2017-07-04 |