Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698082 | Au-based solder die attachment semiconductor device and method for manufacturing the same | Satoshi Tanimoto, Shinji Sato, Kohei Matsui | 2017-07-04 |
HT
Hidekazu Tanisawa
Fuji Electric Co.: 1 patents #147 of 350Top 45%
Sanken Electric Co.: 1 patents #14 of 41Top 35%
Overall (2017): #400,458 of 506,227Top 80%
1
Patents 2017