Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847230 | Method and apparatus for using universal cavity wafer in wafer level packaging | Maurice S. Karpman, Michael Rickley, Andrew J. Mueller, Nicole Mueller, Charles Baab | 2017-12-19 |
| 9693469 | Electronic module subassemblies | Gary B. Tepolt, John Merullo, Berj Nercessian | 2017-06-27 |