Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847230 | Method and apparatus for using universal cavity wafer in wafer level packaging | Michael Rickley, Andrew J. Mueller, Nicole Mueller, Jeffrey C. Thompson, Charles Baab | 2017-12-19 |
| 9735128 | Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules | — | 2017-08-15 |