Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741643 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2017-08-22 |
| 9691748 | Forming a panel of triple stack semiconductor packages | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2017-06-27 |