Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842807 | Integrated circuit assembly | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2017-12-12 |
| 9741643 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Sueann Lim Wei Fen | 2017-08-22 |
| 9691748 | Forming a panel of triple stack semiconductor packages | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2017-06-27 |