Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9772372 | Kill die subroutine at probe for reducing parametric failing devices at package test | Hoi Hin Loo | 2017-09-26 |
| 9664736 | Multiple rate signature test to verify integrated circuit identity | Gunvant Patel | 2017-05-30 |