Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9663357 | Open cavity package using chip-embedding technology | Jie Mao, Hau Nguyen, Luu Thanh Nguyen | 2017-05-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9663357 | Open cavity package using chip-embedding technology | Jie Mao, Hau Nguyen, Luu Thanh Nguyen | 2017-05-30 |