Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9688530 | Integrated circuit package with sensor and method of making | Makoto Shibuya, Noboru Nakanishi | 2017-06-27 |
| 9663357 | Open cavity package using chip-embedding technology | Jie Mao, Hau Nguyen, Anindya Poddar | 2017-05-30 |