Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818666 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Han-Wei Yang, Chen-Chung Lai | 2017-11-14 |
YP
Yen-Ming Peng
Overall (2017): #190,064 of 506,227Top 40%
1
Patents 2017