Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818666 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Yen-Ming Peng, Han-Wei Yang | 2017-11-14 |
| 9773716 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2017-09-26 |
| 9761486 | Method of chip packaging | Gwo-Chyuan Kuo, Han-Wei Yang | 2017-09-12 |