Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837359 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2017-12-05 |
| 9818711 | Post-passivation interconnect structure and methods thereof | Chien-Chia Chiu | 2017-11-14 |
| 9754928 | SMD, IPD, and/or wire mount in a package | Hsien-Wei Chen | 2017-09-05 |