Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711474 | Semiconductor package structure with polymeric layer and manufacturing method thereof | Gia-Her Lu, Liang-Chen Lin, Tung-Chin Yeh, Tung-Jiun Wu | 2017-07-18 |
JW
Jyun-Lin Wu
Overall (2017): #356,906 of 506,227Top 75%
1
Patents 2017