Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711474 | Semiconductor package structure with polymeric layer and manufacturing method thereof | Liang-Chen Lin, Tung-Chin Yeh, Jyun-Lin Wu, Tung-Jiun Wu | 2017-07-18 |
GL
Gia-Her Lu
Overall (2017): #415,166 of 506,227Top 85%
1
Patents 2017