Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837348 | Voids in interconnect structures and methods for forming the same | Ling-Sung Wang | 2017-12-05 |
JH
Jiun-Jie Huang
Overall (2017): #376,076 of 506,227Top 75%
1
Patents 2017