Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761468 | Device and method for wafer taping | Yuh-Sen Chang, Shang-Hsien Lin, Szu-Hsien Lee, Chia-Haw Yeh | 2017-09-12 |
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Chih-Yang Chan
Overall (2017): #467,773 of 506,227Top 95%
1
Patents 2017