Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761468 | Device and method for wafer taping | Yuh-Sen Chang, Shang-Hsien Lin, Chih-Yang Chan, Szu-Hsien Lee | 2017-09-12 |
CY
Chia-Haw Yeh
Overall (2017): #457,371 of 506,227Top 95%
1
Patents 2017