Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761623 | Backside illuminated (BSI) image sensor with a reflector | Yueh-Chuan Lee | 2017-09-12 |
| 9748150 | Test line structure and method for performing wafer acceptance test | Yueh-Chuan Lee, Ping-Chieh Chin | 2017-08-29 |
| 9748187 | Wafer structure and method for wafer dicing | Yueh-Chuan Lee | 2017-08-29 |