Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9841341 | Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors | Jefferson Talledo | 2017-12-12 |
| 9824956 | Surface-mount semiconductor device having exposed solder material | — | 2017-11-21 |
| 9704794 | Electronic device with die being sunk in substrate | Giovanni Graziosi | 2017-07-11 |
| 9698027 | Method of fabricating integrated circuits having a recessed molding package and corresponding package | — | 2017-07-04 |
| 9642244 | Micro-electro-mechanical systems (MEMS) and corresponding manufacturing process | — | 2017-05-02 |
| 9640468 | Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device | — | 2017-05-02 |
| 9618532 | Magnetic inertial sensor and method for operating the same | Giulio Ricotti, Alberto Pagani, Ubaldo Mastromatteo | 2017-04-11 |