Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847281 | Leadframe package with stable extended leads | — | 2017-12-19 |
| 9841341 | Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors | Fulvio Vittorio Fontana | 2017-12-12 |
| 9842828 | Stacked semiconductor package with compliant corners on folded substrate | — | 2017-12-12 |
| 9842794 | Semiconductor package with integrated heatsink | Ela Mia Cadag | 2017-12-12 |
| 9818675 | Semiconductor device including conductive clip with flexible leads and related methods | Ela Mia Cadag | 2017-11-14 |
| 9768126 | Stacked semiconductor packages with cantilever pads | Godfrey Dimayuga | 2017-09-19 |
| 9627224 | Semiconductor device with sloped sidewall and related methods | Godfrey Dimayuga | 2017-04-18 |
| 9578744 | Leadframe package with pre-applied filler material | Frederick Ray Gomez | 2017-02-21 |
| 9536756 | Semiconductor packages separated using a sacrificial material | Amor Zapanta | 2017-01-03 |