Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691778 | Multiheight contact via structures for a multilevel interconnect structure | Keisuke Izumi, Hiroaki Iuchi, Ryo Taura, Akio Yanai | 2017-06-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691778 | Multiheight contact via structures for a multilevel interconnect structure | Keisuke Izumi, Hiroaki Iuchi, Ryo Taura, Akio Yanai | 2017-06-27 |