Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691778 | Multiheight contact via structures for a multilevel interconnect structure | Hiroaki Iuchi, Ryo Taura, Kentaro Sera, Akio Yanai | 2017-06-27 |
| 9601502 | Multiheight contact via structures for a multilevel interconnect structure | Michiaki Sano | 2017-03-21 |