Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716076 | Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof | Nobutoshi Fujii, Kenichi Aoyagi | 2017-07-25 |
| 9666627 | Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film | Nobutoshi Fujii, Kenichi Aoyagi, Yoshihisa Kagawa | 2017-05-30 |