Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799587 | Semiconductor device | Yoshihisa Kagawa | 2017-10-24 |
| 9716076 | Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof | Yoshiya Hagimoto, Kenichi Aoyagi | 2017-07-25 |
| 9666627 | Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film | Yoshiya Hagimoto, Kenichi Aoyagi, Yoshihisa Kagawa | 2017-05-30 |